- Patent Title: Integrated circuit devices and methods of fabricating such devices
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Application No.: US17197496Application Date: 2021-03-10
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Publication No.: US11894376B2Publication Date: 2024-02-06
- Inventor: Dae-Won Ha , Byoung-Hak Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20160099061 2016.08.03
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/84 ; H01L29/78 ; H01L21/02 ; H01L21/266 ; H01L21/8234 ; H01L21/8238 ; H01L27/088 ; H01L29/06 ; H01L29/49 ; H01L29/66 ; H01L29/165 ; H01L29/51

Abstract:
An integrated circuit device includes: a plurality of channel regions spaced apart from each other in an active region; a plurality of source/drain regions; an insulating structure on the active region, the insulating structure defining a plurality of gate spaces; a first gate stack structure in a first of the gate spaces, the first gate stack structure including a first work function metal-containing layer; and an isolation stack structure in a second of the gate spaces that is adjacent the first of the gate spaces, the isolation stack structure having a different stack structure from the first gate stack structure and being configured to electrically isolate a portion of the active region.
Public/Granted literature
- US20210202482A1 INTEGRATED CIRCUIT DEVICES AND METHODS OF FABRICATING SUCH DEVICES Public/Granted day:2021-07-01
Information query
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