Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17068840Application Date: 2020-10-13
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Publication No.: US11894439B2Publication Date: 2024-02-06
- Inventor: Heng-Ching Lin , Yu-Teng Tseng , Chu-Chun Chang , Kuo-Yuh Yang , Chia-Huei Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2010959203.9 2020.09.14
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/78 ; H01L21/265 ; H01L29/423

Abstract:
A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a main branch extending along a first direction on the substrate and a sub-branch extending along a second direction adjacent to the main branch. The semiconductor device also includes a first doped region overlapping the main branch and the sub-branch according to a top view and a second doped region overlapping the first doped region.
Public/Granted literature
- US20220085184A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-17
Information query
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