Invention Grant
- Patent Title: Full nanosheet airgap spacer
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Application No.: US17358275Application Date: 2021-06-25
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Publication No.: US11894442B2Publication Date: 2024-02-06
- Inventor: Jingyun Zhang , Ruilong Xie , Reinaldo Vega , Kangguo Cheng , Lan Yu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Gavin Giraud
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/786 ; H01L29/423

Abstract:
Embodiments disclosed herein include a nanosheet transistor for reducing parasitic capacitance. The nanosheet transistor may include a spacer region between a high-k metal gate and an epitaxial layer. The spacer region may include a first nanosheet stack with a first nanosheet and a second nanosheet. The spacer region may include an inner spacer region between the first nanosheet and the second nanosheet, and a side subway region located along an edge of the first nanosheet, the inner spacer region, and the second nanosheet.
Public/Granted literature
- US20220416056A1 FULL NANOSHEET AIRGAP SPACER Public/Granted day:2022-12-29
Information query
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