- 专利标题: Integrated circuits and methods of manufacturing the same
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申请号: US18093877申请日: 2023-01-06
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公开(公告)号: US11894463B2公开(公告)日: 2024-02-06
- 发明人: Seungmin Song , Bongseok Suh , Junggil Yang , Soojin Jeong
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Muir Patent Law, PLLC
- 优先权: KR 20190071768 2019.06.17
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/423
摘要:
An integrated circuit includes a fin active region protruding from a substrate, a plurality of semiconductor patterns on an upper surface of the fin active region, a gate electrode that surrounds the plurality of semiconductor patterns and includes a main gate part on an uppermost one of the plurality of semiconductor patterns and sub gate parts between the plurality of semiconductor patterns, a spacer structure on a sidewall of the main gate part, and a source/drain region at a side of the gate electrode. The source/drain region is connected to the plurality of semiconductor patterns and contacts a bottom surface of the spacer structure. A top portion of the uppermost semiconductor pattern has a first width. A bottom portion of the uppermost semiconductor pattern has a second width smaller than the first width.
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