Invention Grant
- Patent Title: Integrated circuits and methods of manufacturing the same
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Application No.: US18093877Application Date: 2023-01-06
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Publication No.: US11894463B2Publication Date: 2024-02-06
- Inventor: Seungmin Song , Bongseok Suh , Junggil Yang , Soojin Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190071768 2019.06.17
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/423

Abstract:
An integrated circuit includes a fin active region protruding from a substrate, a plurality of semiconductor patterns on an upper surface of the fin active region, a gate electrode that surrounds the plurality of semiconductor patterns and includes a main gate part on an uppermost one of the plurality of semiconductor patterns and sub gate parts between the plurality of semiconductor patterns, a spacer structure on a sidewall of the main gate part, and a source/drain region at a side of the gate electrode. The source/drain region is connected to the plurality of semiconductor patterns and contacts a bottom surface of the spacer structure. A top portion of the uppermost semiconductor pattern has a first width. A bottom portion of the uppermost semiconductor pattern has a second width smaller than the first width.
Public/Granted literature
- US20230163214A1 INTEGRATED CIRCUITS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2023-05-25
Information query
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