Invention Grant
- Patent Title: Sensing module and manufacturing method thereof
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Application No.: US17363305Application Date: 2021-09-09
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Publication No.: US11894473B2Publication Date: 2024-02-06
- Inventor: Ruei Chi Chen , Chih Lin Yang
- Applicant: CHIP POSITION SYSTEM CO., LTD.
- Applicant Address: TW Hsinchu County
- Assignee: Chu Hua Chang
- Current Assignee: Chu Hua Chang
- Current Assignee Address: TW Zhubei
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; B81C1/00 ; B81B7/00

Abstract:
The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.
Public/Granted literature
- US20230076715A1 SENSING MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-03-09
Information query
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