- 专利标题: Electronic device and method for manufacturing the same
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申请号: US17574067申请日: 2022-01-12
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公开(公告)号: US11895786B2公开(公告)日: 2024-02-06
- 发明人: Sungeun Park
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20210004528 2021.01.13
- 主分类号: H05K5/02
- IPC分类号: H05K5/02 ; H05K5/03 ; H05K5/06
摘要:
Disclosed herein is an electronic device. The electronic device includes a housing provided to accommodate a printed circuit board, a cover coupled to the housing, and including a coupling protrusion protruding to a side of the housing to be accommodated in the housing, and including a coupling hole formed in the coupling protrusion, a fastening pin arranged in the coupling hole and configured to couple to the housing, and a sealing member arranged between an inner wall forming the coupling hole and the fastening pin to seal the coupling hole. Various other embodiments are possible.
公开/授权文献
- US20220225517A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 公开/授权日:2022-07-14
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