Invention Grant
- Patent Title: Electronic device and method for manufacturing the same
-
Application No.: US17574067Application Date: 2022-01-12
-
Publication No.: US11895786B2Publication Date: 2024-02-06
- Inventor: Sungeun Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210004528 2021.01.13
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/03 ; H05K5/06

Abstract:
Disclosed herein is an electronic device. The electronic device includes a housing provided to accommodate a printed circuit board, a cover coupled to the housing, and including a coupling protrusion protruding to a side of the housing to be accommodated in the housing, and including a coupling hole formed in the coupling protrusion, a fastening pin arranged in the coupling hole and configured to couple to the housing, and a sealing member arranged between an inner wall forming the coupling hole and the fastening pin to seal the coupling hole. Various other embodiments are possible.
Public/Granted literature
- US20220225517A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-07-14
Information query