Invention Grant
- Patent Title: Thermoelectric element
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Application No.: US17252062Application Date: 2019-06-05
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Publication No.: US11903313B2Publication Date: 2024-02-13
- Inventor: Se Woon Lee , Young Sam Yoo , Seung Hwan Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & ASSOCIATES, LLP
- Priority: KR 20180073413 2018.06.26
- International Application: PCT/KR2019/006826 2019.06.05
- International Announcement: WO2020/004827A 2020.01.02
- Date entered country: 2020-12-14
- Main IPC: H10N10/17
- IPC: H10N10/17 ; H10N10/13

Abstract:
A thermoelectric element according to one embodiment of the present invention comprises: a first metal substrate; a first resin layer which is arranged on the first metal substrate and which comes into direct contact with the first metal substrate; a plurality of first electrodes arranged on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer arranged on the plurality of second electrodes; and a second metal substrate which is arranged on the second resin layer and which comes into direct contact with the second resin layer, wherein the adhesion strength between the first resin layer and the plurality of first electrodes differs from the adhesion strength between the second resin layer and the plurality of second electrodes.
Public/Granted literature
- US20210249578A1 THERMOELECTRIC ELEMENT Public/Granted day:2021-08-12
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