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公开(公告)号：US11980095B2
公开(公告)日：2024-05-07
申请号：US17041267
申请日：2019-04-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Jae Jeon , Un Hak Lee , Jong Hyun Kang , Young Sam Yoo , Tae Woong Kim
Abstract: A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surface, the first thermoelectric module includes a plurality of group thermoelectric elements, each group thermoelectric element includes a plurality of thermoelectric elements, which have the same minimum spacing distance from the fourth surface in the third direction, and the plurality of thermoelectric elements in at least one group thermoelectric element of the plurality of group thermoelectric elements are electrically connected to each other.
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公开(公告)号：US11974503B2
公开(公告)日：2024-04-30
申请号：US17640019
申请日：2020-09-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Hyun Kim , Young Sam Yoo , Se Woon Lee
IPC: H10N10/17
CPC classification number: H10N10/17
Abstract: Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern. A distance between the third surface and the second substrate is greater than a distance between the first surface and the second substrate, and the adhesive layer is disposed between the second substrate and the first surface.
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公开(公告)号：US20220093839A1
公开(公告)日：2022-03-24
申请号：US17534866
申请日：2021-11-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US11903313B2
公开(公告)日：2024-02-13
申请号：US17252062
申请日：2019-06-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woon Lee , Young Sam Yoo , Seung Hwan Lee
Abstract: A thermoelectric element according to one embodiment of the present invention comprises: a first metal substrate; a first resin layer which is arranged on the first metal substrate and which comes into direct contact with the first metal substrate; a plurality of first electrodes arranged on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer arranged on the plurality of second electrodes; and a second metal substrate which is arranged on the second resin layer and which comes into direct contact with the second resin layer, wherein the adhesion strength between the first resin layer and the plurality of first electrodes differs from the adhesion strength between the second resin layer and the plurality of second electrodes.
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公开(公告)号：US10910541B2
公开(公告)日：2021-02-02
申请号：US16068854
申请日：2017-01-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Young Sam Yoo
Abstract: A thermoelectric element according to one embodiment of the present invention comprises: a first substrate; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs that are alternately arranged on the first substrate; a second substrate disposed on the plurality of P- and N-type thermoelectric legs; and a plurality of electrodes that connect the plurality of P- and N-type thermoelectric legs in series, wherein the plurality of electrodes include a plurality of first electrodes disposed between the first substrate and the plurality of P- and N-type thermoelectric legs, and a plurality of second electrodes disposed between the second substrate and the plurality of P- and N-type thermoelectric legs, and grains constituting at least one of the plurality of first and second electrodes grow in the direction from the first substrate to the second substrate.
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Patent Agency Ranking
公开(公告)号：US11903312B2
公开(公告)日：2024-02-13
申请号：US17534866
申请日：2021-11-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US11205746B2
公开(公告)日：2021-12-21
申请号：US16615516
申请日：2018-06-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US12102008B2
公开(公告)日：2024-09-24
申请号：US17916210
申请日：2021-03-25
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woon Lee , Jong Hyun Kim , Young Sam Yoo
IPC: H10N10/17 , H10N10/817
CPC classification number: H10N10/817 , H10N10/17
Abstract: Provided according to an embodiment is a thermoelectric element comprising: a first insulating part; multiple first electrodes disposed on the first insulating part; a second electrode disposed above the first electrodes; a first conductive semiconductor structure and a second conductive semiconductor structure disposed while being spaced each other between the first electrodes and the second electrode; and a second insulating part disposed on the second electrode, wherein the first insulating part comprises first protrusions protruding toward the first electrodes, and the second insulating part comprises a second protrusion protruding toward the second electrode.
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公开(公告)号：US12058935B2
公开(公告)日：2024-08-06
申请号：US17913982
申请日：2021-03-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woon Lee , Jong Hyun Kim , Young Sam Yoo
Abstract: According to an embodiment, disclosed is a thermoelectric device comprising: a thermoelectric element comprising a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; and a heat sink comprising a plurality of fins disposed to be spaced apart on the second substrate, wherein the second substrate comprises a first region overlapping the second electrodes in a vertical direction and a second region not overlapping the second electrodes in the vertical direction, and wherein separation distances between adjacent fins of the plurality of fins are different from each other in the first region and the second region.
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公开(公告)号：US11139421B2
公开(公告)日：2021-10-05
申请号：US16329687
申请日：2017-08-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Young Sam Yoo , Woo Chul Kim , Hyung Eui Lee , Jong Hyun Kim , Hwan Joo Park , Yoo Min Eom , Jun Phil Hwang
Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.
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