- 专利标题： Electronic device housings with patterned electrolytic plating layers
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申请号： US17602884申请日： 2019-08-08
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公开(公告)号： US11910538B2公开(公告)日： 2024-02-20
- 发明人: Yi-Chen Chen , Kun Cheng Tsai , Kuan-Ting Wu , Ying-Hung Ku , Hsueh Chen Hung
- 申请人： Hewlett-Packard Development Company, L.P.
- 申请人地址： US TX Spring
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Spring
- 代理机构： HP Inc. Patent Department
- 国际申请： PCT/US2019/045593 2019.08.08
- 国际公布： WO2021/025695A 2021.02.11
- 进入国家日期： 2021-10-11
- 主分类号： H05K3/18
- IPC分类号： H05K3/18 ; H05K1/09 ; H05K1/11 ; H05K3/02 ; H05K3/40 ; H05K5/00
摘要：
In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.
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