A semiconductor power module includes a base plate, an insulating substrate, a power semiconductor element, an external terminal, a main terminal, a connected body, a case, a highly-insulating voltage-resisting resin material, a sealing resin, and a cover. The main terminal is connected to the connected body. The connected body is directly joined to the metal plate. The connected body is provided with a receiving section in which the main terminal is received. The receiving section is provided with a slit portion. The slit portion extends from a lower end side of the receiving section toward an upper end side thereof. The lower end side is located on a side close to the insulating substrate. The upper end side is located opposite to the side close to the insulating substrate.