- 专利标题： Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
-
申请号： US17682948申请日： 2022-02-28
-
公开(公告)号： US11929351B2公开(公告)日： 2024-03-12
- 发明人: Kelvin Tan Aik Boo , Chin Hui Chong , Seng Kim Ye , Hong Wan Ng , Hem P. Takiar
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Lowenstein Sandler LLP
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/00 ; H01L23/498 ; H01L25/00
摘要：
An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.
公开/授权文献
信息查询
IPC分类:
