Invention Grant
- Patent Title: Linear spacer for spacing a carrier of a package
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Application No.: US17501568Application Date: 2021-10-14
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Publication No.: US11942383B2Publication Date: 2024-03-26
- Inventor: Edward Fuergut , Chii Shang Hong , Teck Sim Lee , Ralf Otremba , Daniel Pedone , Bernd Schmoelzer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE 2020129423.9 2020.11.09
- Main IPC: H01L23/16
- IPC: H01L23/16 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/367
Abstract:
A package for mounting on a mounting base is disclosed. In one example, the package comprises a carrier, an electronic component mounted at the carrier, leads electrically coupled with the electronic component and to be electrically coupled with the mounting base, and a linear spacer for defining a spacing with respect to the carrier.
Public/Granted literature
- US20220148934A1 LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE Public/Granted day:2022-05-12
Information query
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