- 专利标题: Electronic component
-
申请号: US17487323申请日: 2021-09-28
-
公开(公告)号: US11948750B2公开(公告)日: 2024-04-02
- 发明人: Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20180163289 2018.12.17
- 主分类号: H01G4/232
- IPC分类号: H01G4/232 ; H01G2/06 ; H01G4/30 ; H01G4/12
摘要:
An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
公开/授权文献
- US20220013290A1 ELECTRONIC COMPONENT 公开/授权日:2022-01-13
信息查询