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公开(公告)号：US11581135B2
公开(公告)日：2023-02-14
申请号：US17186390
申请日：2021-02-26
发明人： Min Kyeong Sim , Beom Joon Cho
摘要： An electronic component and a board having the same mounted thereon are provided. The electronic component includes a capacitor body, a pair of external electrodes, respectively disposed on end portions of the capacitor body, a pair of metal frames, respectively disposed to be connected the pair of external electrodes, and a conductive bonding layer disposed between the external electrode and the metal frame and having a discontinuous region.
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公开(公告)号：US10529496B1
公开(公告)日：2020-01-07
申请号：US16169912
申请日：2018-10-24
发明人： Beom Joon Cho , Sang Soo Park , Ki Young Kim , Woo Chul Shin
摘要： An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.
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公开(公告)号：US11948750B2
公开(公告)日：2024-04-02
申请号：US17487323
申请日：2021-09-28
发明人： Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
CPC分类号： H01G4/232 , H01G2/065 , H01G4/30 , H01G4/1227
摘要： An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
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公开(公告)号：US11848159B2
公开(公告)日：2023-12-19
申请号：US17337924
申请日：2021-06-03
发明人： Beom Joon Cho
CPC分类号： H01G4/2325 , H01G4/248 , H01G4/30 , H05K1/111 , H05K1/181 , H05K2201/10015
摘要： A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.
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公开(公告)号：US20230215634A1
公开(公告)日：2023-07-06
申请号：US17977239
申请日：2022-10-31
发明人： Beom Joon Cho
CPC分类号： H01G4/1227 , H01G4/30 , H01G4/232
摘要： A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other, having at least one dielectric layer interposed therebetween in a first direction; and first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode. The body further includes a cover layer disposed to overlap the capacitance region in the first direction, and 1.11 or more is a value obtained by dividing a sum of respective major-axis lengths Lx of a plurality of crystal grains included in the cover layer by a sum of respective minor-axis lengths Sx of the plurality of crystal grains.
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公开(公告)号：US11587729B2
公开(公告)日：2023-02-21
申请号：US17469164
申请日：2021-09-08
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US20220084751A1
公开(公告)日：2022-03-17
申请号：US17239158
申请日：2021-04-23
发明人： Seung Min Ahn , Beom Joon Cho , Ki Young Kim
摘要： An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.
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公开(公告)号：US20220076890A1
公开(公告)日：2022-03-10
申请号：US17208181
申请日：2021-03-22
发明人： Beom Joon Cho , Won Young Jang , Hyeok Jin Park
摘要： An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.
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公开(公告)号：US10886071B2
公开(公告)日：2021-01-05
申请号：US16272752
申请日：2019-02-11
发明人： Ki Young Kim , Woo Chui Shin , Beom Joon Cho , Sang Soo Park
摘要： An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.
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公开(公告)号：US11721481B2
公开(公告)日：2023-08-08
申请号：US17343321
申请日：2021-06-09
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A≤B≤0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.
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