Invention Grant
- Patent Title: Feature selection through solder-ball population
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Application No.: US17216932Application Date: 2021-03-30
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Publication No.: US11948807B2Publication Date: 2024-04-02
- Inventor: Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Peter J. Edwards
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H05K3/40
Abstract:
A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.
Public/Granted literature
- US20220319867A1 FEATURE SELECTION THROUGH SOLDER-BALL POPULATION Public/Granted day:2022-10-06
Information query
IPC分类:
