公开(公告)号：US20240170903A1

公开(公告)日：2024-05-23

申请号：US18057418

申请日：2022-11-21

Applicant: International Business Machines Corporation

Inventor： Theron Lee Lewis ,  Timothy P. Younger ,  David J. Braun ,  James D. Bielick ,  John R. Dangler ,  Stephen Michael Hugo ,  Timothy Jennings

IPC: H01R43/20

CPC classification number: H01R43/205

Abstract: A controlled extraction of an electronic connector from an electronic circuit board includes a press mechanism of a device positioned in spaced relation over a base fixture of the device. The base fixture receiving an electronic circuit board which includes a connector. Shafts of a removal tool of the press mechanism can be inserted into a series of openings in the connector, respectively, in response to applying a downward force to the press mechanism. A capturing element on each of the shafts can be actuated where the capturing element couples to a wall defining the opening of each of the openings. The connector can be removed from the electronic circuit board by applying an upward force to the press mechanism which removes the connector with the capturing element of the shafts coupled to the wall of the opening, and releasing the press mechanism from the base fixture.

公开(公告)号：US20240121890A1

公开(公告)日：2024-04-11

申请号：US17963138

申请日：2022-10-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur J. Higby ,  DAVID CLIFFORD LONG ,  James Busby ,  William Santiago-Fernandez ,  John R. Dangler ,  Russell A. Budd ,  Philipp K Buchling Rego ,  Hannah Wendling ,  Lauren Boston

IPC: H05K1/02 ,  H05K5/02

CPC classification number: H05K1/0275 ,  H05K1/0292 ,  H05K5/0208 ,  H05K5/0217

Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

公开(公告)号：US20230228824A1

公开(公告)日：2023-07-20

申请号：US18188963

申请日：2023-03-23

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Gerald Bartley ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01R31/52 ,  H05K1/02 ,  G06F30/30 ,  H05K7/20 ,  H05K3/00 ,  G01K15/00 ,  H02H7/20

CPC classification number: G01R31/52 ,  G01K15/007 ,  G06F30/30 ,  H02H7/20 ,  H05K1/0201 ,  H05K1/0277 ,  H05K3/0005 ,  H05K7/20209 ,  H05K2201/012

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

公开(公告)号：US20230178922A1

公开(公告)日：2023-06-08

申请号：US17457737

申请日：2021-12-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Theron Lee Lewis ,  David J. Braun ,  James D. Bielick ,  John R. Dangler ,  Timothy P. Younger ,  Timothy Jennings ,  Jennifer I. Bennett ,  Stephen Michael Hugo

IPC: H01R13/516 ,  H01R43/02 ,  F16B1/00 ,  H01R12/57

CPC classification number: H01R13/516 ,  H01R43/0256 ,  F16B1/0014 ,  H01R12/57

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

公开(公告)号：US11647591B2

公开(公告)日：2023-05-09

申请号：US17343857

申请日：2021-06-10

Applicant: International Business Machines Corporation

Inventor： Theron Lee Lewis ,  David J. Braun ,  John R. Dangler

IPC: H05K3/22 ,  H05K3/34 ,  H01R12/58 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K101/42

CPC classification number: H05K3/225 ,  B23K1/0016 ,  B23K1/203 ,  B23K3/0653 ,  H01R12/58 ,  H05K3/3447 ,  B23K2101/42 ,  H05K2203/044 ,  H05K2203/143 ,  H05K2203/16 ,  H05K2203/173

Abstract: Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

公开(公告)号：US20220317092A1

公开(公告)日：2022-10-06

申请号：US17217592

申请日：2021-03-30

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  John R. Dangler ,  Thomas W. Liang ,  Jason J. Bjorgaard ,  Kyle Schoneck ,  Matthew A. Walther

IPC: G01N29/26 ,  H01B11/18 ,  G01N29/44

Abstract: A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.

公开(公告)号：US20220201839A1

公开(公告)日：2022-06-23

申请号：US17124621

申请日：2020-12-17

Applicant: International Business Machines Corporation

Inventor： John R. Dangler ,  Arthur J. Higby ,  Philipp K. Buchling Rego ,  DAVID CLIFFORD LONG ,  James Busby ,  MATTHEW DOYLE ,  Edward N. Cohen ,  MICHAEL FISHER ,  William Santiago-Fernandez

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/44 ,  H05K5/02

Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

公开(公告)号：US11235625B2

公开(公告)日：2022-02-01

申请号：US16173304

申请日：2018-10-29

Applicant: International Business Machines Corporation

Inventor： Matthew S. Doyle ,  Layne A. Berge ,  Jason J. Bjorgaard ,  John R. Dangler ,  Thomas W. Liang ,  Manuel Orozco

IPC: B60C11/24 ,  B60C23/06 ,  G01M17/02 ,  H01Q1/22

Abstract: A method, system and computer program product are provided for implementing tire tread depth and wear patterns monitoring. A radio frequency identification (RFID) tag is provided with an associated tire to be monitored. A dipole antenna structure is coupled to the RFID tag and routed within a position in the tire tread and routed substantially circumferentially in the associated tire. A resonant frequency of the dipole antenna structure is detected to monitor tire tread wear.

公开(公告)号：US11226369B2

公开(公告)日：2022-01-18

申请号：US16583521

申请日：2019-09-26

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Thomas W. Liang ,  Matthew A. Walther ,  Jason J. Bjorgaard ,  John R. Dangler

IPC: G01R31/28

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

公开(公告)号：US20220005649A1

公开(公告)日：2022-01-06

申请号：US16918251

申请日：2020-07-01

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  John R. Dangler ,  Kyle Schoneck ,  Thomas W. Liang ,  Matthew A. Walther ,  Jason J. Bjorgaard

IPC: H01G4/35 ,  H05K1/02 ,  H05K1/16 ,  H01L49/02 ,  H01G4/28

Abstract: A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.