- 专利标题: Electrostatic chuck and processing apparatus
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申请号: US17642083申请日: 2020-12-24
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公开(公告)号: US11955360B2公开(公告)日: 2024-04-09
- 发明人: Takeshi Takabatake , Tomohiro Nakasuji , Akira Itoh , Kentaro Seto , Yutaka Omoto , Hiroho Kitada , Kazuumi Tanaka
- 申请人: TOCALO Co., Ltd. , HITACHI HIGH-TECH CORPORATION
- 申请人地址: JP Kobe
- 专利权人: TOCALO CO., Ltd.,HITACHI HIGH-TECH CORPORATION
- 当前专利权人: TOCALO CO., Ltd.,HITACHI HIGH-TECH CORPORATION
- 当前专利权人地址: JP Kobe; JP Tokyo
- 代理机构: Faegre Drinker Biddle & Reath LLP
- 国际申请: PCT/JP2020/048578 2020.12.24
- 国际公布: WO2022/137467A 2022.06.30
- 进入国家日期: 2022-03-10
- 主分类号: H01L21/683
- IPC分类号: H01L21/683 ; H01J37/32 ; H01L21/687
摘要:
A Johnsen-Rahbek force type electrostatic chuck including: a metal substrate; an electrode for electrostatic attraction provided on the metal substrate with an insulating layer interposed between the metal substrate and the electrode for electrostatic attraction; and a dielectric layer constituting an electrostatic attraction surface in contact with a workpiece. The dielectric layer includes a ceramic spray coating and a sealing component with which pores of the ceramic spray coating are filled, and the sealing component contains a metal organic salt containing a rare earth element.
公开/授权文献
- US20230154780A1 ELECTROSTATIC CHUCK AND PROCESSING APPARATUS 公开/授权日:2023-05-18
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