Invention Grant
- Patent Title: Electrostatic chuck and processing apparatus
-
Application No.: US17642083Application Date: 2020-12-24
-
Publication No.: US11955360B2Publication Date: 2024-04-09
- Inventor: Takeshi Takabatake , Tomohiro Nakasuji , Akira Itoh , Kentaro Seto , Yutaka Omoto , Hiroho Kitada , Kazuumi Tanaka
- Applicant: TOCALO Co., Ltd. , HITACHI HIGH-TECH CORPORATION
- Applicant Address: JP Kobe
- Assignee: TOCALO CO., Ltd.,HITACHI HIGH-TECH CORPORATION
- Current Assignee: TOCALO CO., Ltd.,HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Kobe; JP Tokyo
- Agency: Faegre Drinker Biddle & Reath LLP
- International Application: PCT/JP2020/048578 2020.12.24
- International Announcement: WO2022/137467A 2022.06.30
- Date entered country: 2022-03-10
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; H01L21/687

Abstract:
A Johnsen-Rahbek force type electrostatic chuck including: a metal substrate; an electrode for electrostatic attraction provided on the metal substrate with an insulating layer interposed between the metal substrate and the electrode for electrostatic attraction; and a dielectric layer constituting an electrostatic attraction surface in contact with a workpiece. The dielectric layer includes a ceramic spray coating and a sealing component with which pores of the ceramic spray coating are filled, and the sealing component contains a metal organic salt containing a rare earth element.
Public/Granted literature
- US20230154780A1 ELECTROSTATIC CHUCK AND PROCESSING APPARATUS Public/Granted day:2023-05-18
Information query
IPC分类: