Invention Grant
- Patent Title: Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
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Application No.: US17298879Application Date: 2019-11-18
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Publication No.: US11955588B2Publication Date: 2024-04-09
- Inventor: Korbinian Perzlmaier , Kerstin Neveling , Heribert Zull
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: MH2 TECHNOLOGY LAW GROUP LLP
- Priority: DE 2018131404.3 2018.12.07
- International Application: PCT/EP2019/081627 2019.11.18
- International Announcement: WO2020/114759A 2020.06.11
- Date entered country: 2021-06-01
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00

Abstract:
In one embodiment, the optoelectronic semiconductor device comprises a semiconductor layer sequence and an electrical via. The semiconductor layer sequence includes an active zone for generating radiation and a contact layer for electrical contacting. The active zone lies in a plane perpendicular to a main growth direction of the semiconductor layer sequence and is located between a first semiconductor region and a second semiconductor region. The contact layer is located within the second semiconductor region. The via extends through the contact layer and preferably ends within the second semiconductor region. A contact surface between the via and the contact layer encloses a contact angle of at least 20° and at most 60° with respect to the plane.
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Information query
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