Invention Grant
- Patent Title: Foam pad structure having protective film
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Application No.: US17487218Application Date: 2021-09-28
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Publication No.: US11957252B2Publication Date: 2024-04-16
- Inventor: Hung Ya Wang
- Applicant: Hung Ya Wang
- Applicant Address: TW Taichung
- Assignee: Hung Ya Wang
- Current Assignee: Hung Ya Wang
- Current Assignee Address: TW Taichung
- Agency: Rosenberg, Klein & Lee
- Main IPC: B32B5/18
- IPC: B32B5/18 ; A47C27/00 ; A47C27/15 ; A63B21/00 ; B32B38/00 ; C09D11/10 ; C09D11/102 ; B32B37/12

Abstract:
A foam pad structure having a protective film includes a substrate layer, a hot glue layer, a printed pattern layer, and an adhesive film. The substrate layer is made of a foam material. The substrate layer has two surfaces arranged oppositely on its upper and lower sides. The hot glue layer is coated on at least one of the two surfaces of the substrate layer. The hot glue layer has an adhesive surface facing away from the substrate layer. The printed pattern layer is composed of a pigment containing the same composition as the hot glue layer. The printed pattern layer is printed on the adhesive surface of the hot glue layer. The hot glue layer and the printed pattern layer are melted between the substrate layer and the adhesive film.
Public/Granted literature
- US20230102636A1 FOAM PAD STRUCTURE HAVING PROTECTIVE FILM Public/Granted day:2023-03-30
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