Invention Grant
- Patent Title: Semiconductor device, method of manufacturing a semiconductor device, solid-state imaging device, and electronic apparatus
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Application No.: US16074669Application Date: 2016-11-02
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Publication No.: US11961865B2Publication Date: 2024-04-16
- Inventor: Hideaki Togashi , Kosuke Nakanishi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross PC
- Priority: JP 16022717 2016.02.09
- International Application: PCT/JP2016/082572 2016.11.02
- International Announcement: WO2017/138197A 2017.08.17
- Date entered country: 2018-08-01
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/8234 ; H01L23/48 ; H01L27/088 ; H01L29/08 ; H01L29/423 ; H01L29/78 ; H01L27/06

Abstract:
A semiconductor device of the present disclosure includes: a semiconductor element disposed on a first surface side of a semiconductor substrate; a through-electrode that is provided through the semiconductor substrate in a thickness direction of the semiconductor substrate and introduces charge obtained in the semiconductor element to a second surface side of the semiconductor substrate; and an amplifier transistor that outputs an electrical signal based on the charge introduced by the through-electrode, the amplifier transistor using the through-electrode as a gate electrode and including a source region and a drain region around the through-electrode.
Public/Granted literature
Information query
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