Invention Grant
- Patent Title: Heat dissipating connectors
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Application No.: US17568696Application Date: 2022-01-04
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Publication No.: US11962114B2Publication Date: 2024-04-16
- Inventor: Joshua C. Ivancic , Noah P. Montena , Daniel Daoust
- Applicant: PPC BROADBAND, INC.
- Applicant Address: US NY East Syracuse
- Assignee: PPC BROADBAND, INC.
- Current Assignee: PPC BROADBAND, INC.
- Current Assignee Address: US NY East Syracuse
- Agency: MH2 TECHNOLOGY LAW GROUP LLP
- Main IPC: H01R24/40
- IPC: H01R24/40 ; H01R103/00

Abstract:
A heat dissipating hardline connector includes a first body portion configured to support a terminal pin assembly and a second body portion configured to be coupled with the first body portion. The second body portion is configured to receive a hardline cable. The second body portion includes a plurality of spaced apart annular grooves formed in an outer surface of the second body portion to define a plurality of fin portions that are spaced apart from one another along a length of the second body portion. The annular grooves and fin portions are configured to increase the surface area of the outer surface of the second body portion to provide increased heat dissipation by the second body portion.
Public/Granted literature
- US20220209476A1 HEAT DISSIPATING CONNECTORS Public/Granted day:2022-06-30
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