Invention Grant
- Patent Title: Slim heat-dissipation module
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Application No.: US17520958Application Date: 2021-11-08
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Publication No.: US11965698B2Publication Date: 2024-04-23
- Inventor: Shih-Lin Huang , Ting-Yuan Wu
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: MUNCY, GEISSLER, OLDS & LOWE, PC
- Priority: CN 1711463208.7 2017.12.28
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04

Abstract:
A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.
Public/Granted literature
- US20220057143A1 SLIM HEAT-DISSIPATION MODULE Public/Granted day:2022-02-24
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