- 专利标题: Semiconductor device and manufacturing method of semiconductor device
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申请号: US18103228申请日: 2023-01-30
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公开(公告)号: US11967555B2公开(公告)日: 2024-04-23
- 发明人: Nam Jae Lee
- 申请人: SK hynix Inc.
- 申请人地址: KR Icheon-si
- 专利权人: SK hynix Inc.
- 当前专利权人: SK hynix Inc.
- 当前专利权人地址: KR Icheon-si
- 代理机构: WILLIAM PARK & ASSOCIATES LTD.
- 优先权: KR 20200093249 2020.07.27
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H10B43/27
摘要:
A semiconductor device includes: a stack structure including conductive patterns and stack insulating layers, which are alternately stacked; a channel structure penetrating the stack structure; a tunnel insulating layer surrounding the channel structure; a cell storage pattern surrounding the tunnel insulating layer; and a dummy storage pattern surrounding the tunnel insulating layer, the dummy storage pattern being spaced apart from the cell storage pattern. The conductive patterns include a select conductive pattern in contact with the tunnel insulating layer.
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