• 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
  • 申请号: US18103228
    申请日: 2023-01-30
  • 公开(公告)号: US20230178485A1
    公开(公告)日: 2023-06-08
  • 发明人: Nam Jae LEE
  • 申请人: SK hynix Inc.
  • 申请人地址: KR Icheon-si
  • 专利权人: SK hynix Inc.
  • 当前专利权人: SK hynix Inc.
  • 当前专利权人地址: KR Icheon-si
  • 优先权: KR 20200093249 2020.07.27
  • 主分类号: H01L23/528
  • IPC分类号: H01L23/528 H10B43/27
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要:
A semiconductor device includes: a stack structure including conductive patterns and stack insulating layers, which are alternately stacked; a channel structure penetrating the stack structure; a tunnel insulating layer surrounding the channel structure; a cell storage pattern surrounding the tunnel insulating layer; and a dummy storage pattern surrounding the tunnel insulating layer, the dummy storage pattern being spaced apart from the cell storage pattern. The conductive patterns include a select conductive pattern in contact with the tunnel insulating layer.
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