- Patent Title: Multi-layered air waveguide antenna with layer-to-layer connections
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Application No.: US17323877Application Date: 2021-05-18
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Publication No.: US11973268B2Publication Date: 2024-04-30
- Inventor: Scott D. Brandenburg , David Wayne Zimmerman , Mark William Hudson
- Applicant: Aptiv Technologies AG
- Applicant Address: CH Schaffhausen
- Assignee: Aptiv Technologies AG
- Current Assignee: Aptiv Technologies AG
- Current Assignee Address: CH Schaffhausen
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01Q13/18
- IPC: H01Q13/18 ; G01S7/03 ; G01S13/931 ; H01Q1/32 ; H01Q1/38 ; H01Q1/42 ; G01S13/00

Abstract:
This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.
Public/Granted literature
- US20220352640A1 Multi-Layered Air Waveguide Antenna with Layer-to-Layer Connections Public/Granted day:2022-11-03
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