Invention Grant
- Patent Title: Semiconductor device including relay chip
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Application No.: US17681423Application Date: 2022-02-25
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Publication No.: US11977777B2Publication Date: 2024-05-07
- Inventor: Yohei Yasuda
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 21096711 2021.06.09
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G06F3/06 ; G11C7/10 ; G11C7/22 ; G11C16/10

Abstract:
A semiconductor device includes a relay chip configured to be connected to a host; a first chip connected to the relay chip via a first channel; and a second chip connected to the relay chip via a second channel. The relay chip is configured to receive, from the host, a first enable signal for selecting the first channel and a second enable signal for selecting the second channel. During a first period in which the first enable signal is maintained at a non-active level and the second enable signal is maintained at an active level, the relay chip is configured to perform, in parallel, a first data transfer operation via the first channel and a first command issuing operation via the second channel.
Public/Granted literature
- US20220398043A1 SEMICONDUCTOR DEVICE, MEMORY SYSTEM, AND CHIP Public/Granted day:2022-12-15
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