Invention Grant
- Patent Title: Electronic component, electric device including the same, and bonding method thereof
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Application No.: US18326426Application Date: 2023-05-31
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Publication No.: US11979987B2Publication Date: 2024-05-07
- Inventor: Han-Sung Bae , Wonkyu Kwak , Cheolgeun An
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR 20130047535 2013.04.29 KR 20140043134 2014.04.10 KR 20140043136 2014.04.10 KR 20140079080 2014.06.26
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G02F1/1345 ; H01L23/00 ; H05K1/11 ; H01L23/495 ; H05K3/30 ; H05K3/36

Abstract:
Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.
Public/Granted literature
- US20230309225A1 ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF Public/Granted day:2023-09-28
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