Invention Grant
- Patent Title: Device for self-assembling semiconductor light-emitting diodes
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Application No.: US17579289Application Date: 2022-01-19
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Publication No.: US11984337B2Publication Date: 2024-05-14
- Inventor: Inbum Yang , Junghun Rho , Imdeok Jung , Bongwoon Choi
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR 20190115574 2019.09.19
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L25/075 ; H01L33/00
Abstract:
Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.
Public/Granted literature
- US20220139747A1 DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES Public/Granted day:2022-05-05
Information query
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