- 专利标题: Honeycomb structure and electric heating support using the honeycomb structure
-
申请号: US17654406申请日: 2022-03-11
-
公开(公告)号: US11986812B2公开(公告)日: 2024-05-21
- 发明人: Makoto Hamazaki , Takayuki Inoue , Kohei Yamada
- 申请人: NGK INSULATORS, LTD.
- 申请人地址: JP Nagoya
- 专利权人: NGK INSULATORS, LTD.
- 当前专利权人: NGK INSULATORS, LTD.
- 当前专利权人地址: JP Nagoya
- 代理机构: BURR PATENT LAW, PLLC
- 优先权: JP 21045377 2021.03.19 JP 22001686 2022.01.07
- 主分类号: B01J35/56
- IPC分类号: B01J35/56 ; B01D53/94 ; B01J21/08 ; B01J27/224
摘要:
A honeycomb structure according to at least one embodiment of the present invention includes: partition walls defining cells each extending from a first end surface of the honeycomb structure to a second end surface thereof to form a fluid flow path; and an outer peripheral wall. The partition walls and the outer peripheral wall are each formed of ceramics containing silicon carbide and silicon. A surface of the silicon has formed thereon an oxide film having a thickness of from 0.1 μm to 5.0 μm.
公开/授权文献
信息查询