- 专利标题： Systems and methods for evacuated injection repair of bondline voids
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申请号： US17551320申请日： 2021-12-15
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公开(公告)号： US11987015B2公开(公告)日： 2024-05-21
- 发明人: Joseph L. Hafenrichter , Gary E. Georgeson , Marc J. Piehl
- 申请人： The Boeing Company
- 申请人地址： US IL Chicago
- 专利权人： The Boeing Company
- 当前专利权人： The Boeing Company
- 当前专利权人地址： US VA Arlington
- 代理机构： McDonnell Boehnen Hulbert & Berghoff LLP
- 主分类号： B29C73/02
- IPC分类号： B29C73/02 ; B29C73/24 ; B29L31/30
摘要：
In an example, a method is described. The method comprises forming a single hole into a bond gap repair area. The method also comprises evacuating, via an adhesive injection apparatus attached to the single hole, the bond gap repair area and an injection channel of the adhesive injection apparatus. The method also comprises forcing adhesive through the evacuated injection channel and into the evacuated bond gap repair area.
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