A job-site gear in one aspect of the present disclosure includes a circuit board, at least one electronic component, and a resin member. A first surface of the circuit board includes a first area, a second area, and a third area. The third area is located in a boundary between the first area and the second area. A second surface of the circuit board includes a fourth area, a fifth area, and a sixth area located behind the first area, the second area, and the third area, respectively. The third area and the sixth area include at least one slit penetrating through the circuit board. The resin member is integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component on the first area.