- 专利标题： Ceramic printed fuse fabrication
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申请号： US17538438申请日： 2021-11-30
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公开(公告)号： US12002643B2公开(公告)日： 2024-06-04
- 发明人: Venkat raman Thenkarai Narayanan , Miroslav Horky , Robert Stephen Douglass , John Trublowski
- 申请人： EATON INTELLIGENT POWER LIMITED
- 申请人地址： IE Dublin
- 专利权人： Eaton Intelligent Power Limited
- 当前专利权人： Eaton Intelligent Power Limited
- 当前专利权人地址： IE Dublin
- 代理机构： Baker Botts L.L.P.
- 主分类号： H01H85/046
- IPC分类号： H01H85/046 ; H01H69/02 ; H01H85/042 ; H01H85/38
摘要：
A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.
公开/授权文献
- US20230170174A1 CERAMIC PRINTED FUSE FABRICATION 公开/授权日：2023-06-01
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