Invention Grant
- Patent Title: Cutting tool
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Application No.: US18033357Application Date: 2022-09-22
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Publication No.: US12005508B2Publication Date: 2024-06-11
- Inventor: Haruyo Fukui , Nozomi Tsukihara , Anongsack Paseuth , Toshihiro Tabata
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: XSENSUS LLP
- International Application: PCT/JP2022/035452 2022.09.22
- Date entered country: 2023-04-24
- Main IPC: E21B10/46
- IPC: E21B10/46 ; B23B27/14 ; E21B10/56 ; E21B10/567

Abstract:
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of Ti1-a-bAlaCebN, a is between greater than or equal to 0.350 and equal to or less than 0.650, b is between greater than or equal to 0.001 and equal to or less than 0.100, the second unit layer is composed of TicSi1-cN, and c is between greater than or equal to 0.20 and equal to or less than 0.99.
Public/Granted literature
- US20240100603A1 CUTTING TOOL Public/Granted day:2024-03-28
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