Invention Grant
- Patent Title: Article comprising puncture resistant laminate with ultra-thin glass layer
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Application No.: US17270916Application Date: 2019-08-13
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Publication No.: US12005677B2Publication Date: 2024-06-11
- Inventor: Shinu Baby , Kuan-Ting Kuo , Yousef Kayed Qaroush , Robert Lee Smith, III
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Jeffrey A. Schmidt
- International Application: PCT/US2019/046263 2019.08.13
- International Announcement: WO2020/041032A 2020.02.27
- Date entered country: 2021-02-24
- Main IPC: B32B17/06
- IPC: B32B17/06 ; B32B7/12
Abstract:
An article including a laminate having a substrate and an ultra-thin cover glass layer bonded to atop surface of the substrate. The ultra-thin cover glass layer has a thickness in the range of 1 micron to 49 microns. The ultra-thin cover glass layer is bonded to the top surface of the substrate with an optically transparent adhesive layer having a thickness in the range of 5 microns to 50 microns.
Public/Granted literature
- US20210178730A1 ARTICLE COMPRISING PUNCTURE RESISTANT LAMINATE WITH ULTRA-THIN GLASS LAYER Public/Granted day:2021-06-17
Information query
