Invention Grant
- Patent Title: Aperture module and camera module
-
Application No.: US17179655Application Date: 2021-02-19
-
Publication No.: US12013550B2Publication Date: 2024-06-18
- Inventor: Se Yeon Hwang , Seok Hwan Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20200139601 2020.10.26
- Main IPC: G02B27/64
- IPC: G02B27/64 ; G02B7/02
Abstract:
An aperture module includes: a base; a rotating plate rotatably disposed on the base; and blades configured to form an incident hole and move by rotation of the rotating plate to change a size of the incident hole. The blades are disposed in an opening disposed inside the rotating plate.
Public/Granted literature
- US20220128832A1 APERTURE MODULE AND CAMERA MODULE Public/Granted day:2022-04-28
Information query
