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    Camera module
    1.
    发明授权
    Camera module 有权

    公开(公告)号：US11936969B2

    公开(公告)日：2024-03-19

    申请号：US17752262

    申请日：2022-05-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Se Yeon Hwang ,  Hyun Sang Kwak ,  Yeo Ok Jeon ,  Joon Woo Gi ,  Seok Hwan Kim

    IPC: H04N23/54 ,  H04N23/57 ,  H05K1/18

    CPC classification number: H04N23/54 ,  H04N23/57 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10151

    Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

    Thermoelectric module and method for manufacturing the same
    2.
    发明授权
    Thermoelectric module and method for manufacturing the same 有权

    公开(公告)号：US12295264B2

    公开(公告)日：2025-05-06

    申请号：US17741352

    申请日：2022-05-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Han Kim ,  Se Yeon Hwang ,  Joon Woo Gi ,  Jong Ho Chung ,  Han Kim

    IPC: H10N10/17 ,  H10N10/01 ,  H10N10/855

    Abstract: A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.

    Camera module
    3.
    发明授权
    Camera module 有权

    公开(公告)号：US12063428B2

    公开(公告)日：2024-08-13

    申请号：US17989832

    申请日：2022-11-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Se Yeon Hwang ,  Yeo Ok Jeon ,  Seok Hwan Kim ,  Seung Jae Song ,  Han Kim

    IPC: H04N23/54 ,  H04M1/02

    CPC classification number: H04N23/54 ,  H04M1/0264 ,  H04M2250/52

    Abstract: A camera module is provided. The camera module includes a lens barrel in which at least one lens is installed; and a lens holder to which the lens barrel is fixedly installed, wherein one of the lens holder and the lens barrel is provided with a coupling protrusion, and the other thereof is provided with a coupling groove into which the coupling protrusion is inserted, the lens holder is provided with a support portion that supports one end portion of the lens barrel, wherein the one end portion of the lens barrel is disposed between the coupling protrusion and the support portion, and the support portion of the lens holder elastically supports the lens barrel in an optical axis direction.

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