Invention Grant
- Patent Title: Sound attenuating building panels
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Application No.: US17165478Application Date: 2021-02-02
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Publication No.: US12017441B2Publication Date: 2024-06-25
- Inventor: Phi-Oanh R. Pham , William H. Frantz , Sean D. Browne
- Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
- Applicant Address: US PA Lancaster
- Assignee: AWI Licensing LLC
- Current Assignee: AWI Licensing LLC
- Current Assignee Address: US DE Wilmington
- Agent Patrick Sheldrake
- Main IPC: E04B9/04
- IPC: E04B9/04 ; B32B5/22 ; B32B5/24 ; B32B13/04 ; B32B13/14 ; B32B18/00 ; E04B9/00

Abstract:
An acoustical ceiling panel including a first layer having a first major surface opposite a second major surface and a side surface extending therebetween, a second layer having a first major surface opposite a second major surface and a side surface extending therebetween, and a sealing layer having a first major surface opposite a second major surface and a side surface extending therebetween. The sealing layer may be positioned between the first major surface of the first layer and the second major surface of the second layer. The side surface of the sealing layer may extend beyond the side surface of the first layer and the side surface of the second layer.
Public/Granted literature
- US20210245471A1 SOUND ATTENUATING BUILDING PANELS Public/Granted day:2021-08-12
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