A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.