An electrical assembly includes a support element which has a body and a surface formed on the body, an electrical functional element arranged on the support element, and a temperature monitoring device arranged on the support element for monitoring a temperature on the electrical functional element. The temperature monitoring device includes a temperature sensor arranged on the surface of the support element, a physical contact element arranged on the surface of the support element, and at least one heat-conducting device embedded in the body of the support element. The at least one heat-conducting device extends at least in sections below the temperature sensor in the body and is thermally connected to the physical contact element via at least one through-connection. The physical contact element is thermally coupled to a coupling surface operatively connected to the electrical functional element.