A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.