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公开(公告)号：US12205927B2
公开(公告)日：2025-01-21
申请号：US17281872
申请日：2020-02-21
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao Liu , Zhongbao Wu , Gongtao Zhang , Haiwei Sun , Xue Dong
IPC: H01L25/075 , G06F1/16 , G06F3/14 , G09G3/3225 , G09G3/36 , H01L27/12 , H01L33/60 , H01L33/62 , H10K77/10
Abstract: An array substrate is provided. In the array substrate, an organic material layer includes a first planar portion, a bending portion and a second planar portion which are connected in sequence. The first planar portion and the second planar portion are disposed on both sides of a base substrate. A lead structure includes a first lead portion, a bent lead portion and a second lead portion which are connected in sequence, wherein the first lead portion is disposed outside the first plane portion, the bent lead portion is disposed outside the bending portion, and the second lead portion is disposed outside the second plane portion. An LED layer and a control circuit are respectively disposed on the both sides of the base substrates.
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2.发明申请公开(公告)号：US20240405179A1
公开(公告)日：2024-12-05
申请号：US18697192
申请日：2022-08-11
IPC: H01L33/62 , H01L25/075 , H01L33/40
Abstract: A display panel includes a substrate, first bonding electrodes, connecting leads, an electrode carrier plate and second bonding electrodes. The substrate includes a display surface, a non-display surface, and a selected side face. The display surface includes a first bonding area, and the non-display surface includes a second bonding area. The first bonding electrodes are arranged side by side at the intervals in the first bonding area. The connecting leads are arranged side by side at intervals, each connecting lead includes a first portion, a second portion and a third portion, and the first portion of each connecting lead is electrically connected to a first bonding electrode. The electrode carrier plate is arranged on the non-display surface and provided thereon with the second bonding electrodes arranged side by side at intervals, and each second bonding electrode is electrically connected to a third portion of a connecting lead.
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3.发明公开公开(公告)号：US20240136336A1
公开(公告)日：2024-04-25
申请号：US17769825
申请日：2021-06-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xinhong Lu , Xiaoyan Zhu , Chao Liu , Shuilang Dong , Jiushi Wang , Liuqing Li
IPC: H01L25/075 , H01L25/16 , H01L33/62
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/62 , H01L2933/0066
Abstract: A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.
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公开(公告)号：US11482545B2
公开(公告)日：2022-10-25
申请号：US17040510
申请日：2020-03-18
Inventor： Yonglian Qi , Chao Liu , Lianjie Qu , Hebin Zhao , Shan Zhang , Ning Jia , Guangdong Shi , Shuai Liu
IPC: H01L27/12 , H01L25/075 , G09G3/32
Abstract: A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.
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公开(公告)号：US11387427B2
公开(公告)日：2022-07-12
申请号：US16718869
申请日：2019-12-18
Inventor： Yuli Dai , Qiang Xiong , Chao Liu , Min Li
Abstract: A display panel includes a display substrate, an opposite substrate, and a hydrophobic bonding portion disposed between the display substrate and the opposite substrate. The hydrophobic bonding portion is configured to bond the display substrate and the opposite substrate together, and an orthographic projection of the hydrophobic bonding portion on the display substrate is located outside a display region of the display substrate.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20210157361A1
公开(公告)日：2021-05-27
申请号：US17022486
申请日：2020-09-16
Inventor： Shan Zhang , Hong Yang , Lianjie Qu , Yonglian Qi , Hebin Zhao , Yun Qiu , Chao Liu , Zhenhua Lv , Yang You
Abstract: To construct a display substrate, a first metal connection part is formed on a first surface of a base substrate, extending to a first surface edge region, and a second metal connection part is formed on a second surface of the base substrate opposite to the first surface, extending to a second surface edge region. A flexible film formed on the first surface is patterned to expose a portion of the first surface edge region, aligned with the first metal connection part. A portion of the base substrate covered by the first surface edge region is removed. A portion of the flexible film in the first surface edge region is bent to cover at least a portion of a sidewall of the base substrate. A sidewall metal connection part is formed to electrically connect the first and second metal connection parts, and the flexible film is removed.
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7.发明申请公开(公告)号：US20190204650A1
公开(公告)日：2019-07-04
申请号：US16057465
申请日：2018-08-07
IPC: G02F1/1343 , G02F1/1335 , C03B17/06 , C03B17/02 , B32B17/06 , C03C3/091
CPC classification number: G02F1/13439 , B32B17/06 , B32B2307/202 , B32B2307/206 , B32B2457/20 , C03B17/02 , C03B17/064 , C03C3/091 , G02F1/133516 , G02F1/13394 , G02F2001/13396 , G02F2201/121 , G02F2202/09 , G02F2202/16
Abstract: The present disclosure relates to a substrate, a device for manufacturing the substrate, a manufacturing method and a display device, which belong to display related technical field. The substrate has a single layer structure and includes a conductive portion and a non-conductive portion in a thickness direction.
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公开(公告)号：US09842735B2
公开(公告)日：2017-12-12
申请号：US14908678
申请日：2015-07-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yanan Niu , Chao Liu , Zengsheng He , Lei Chen , Yujun Zhang
IPC: H01L21/00 , H01L21/84 , H01L21/02 , H01L29/78 , H01L29/786 , H01L21/308 , H01L27/12 , H01L29/66
CPC classification number: H01L21/02675 , H01L21/02057 , H01L21/02532 , H01L21/02592 , H01L21/02686 , H01L21/3085 , H01L21/3086 , H01L27/1222 , H01L27/1274 , H01L27/1285 , H01L27/1288 , H01L27/1296 , H01L29/66757 , H01L29/786 , H01L29/78675
Abstract: A method of manufacturing a low temperature polycrystalline silicon thin film and a thin film transistor, a thin film transistor, a display panel and a display device are provided. The method includes: forming an amorphous silicon thin film (01) on a substrate (1); forming a pattern of a silicon oxide thin film (02) covering the amorphous silicon thin film (01), a thickness of the silicon oxide thin film (02) located at a preset region being larger than that of the silicon oxide thin film (02) located at other regions; and irradiating the silicon oxide thin film (02) by using excimer laser to allow the amorphous silicon thin film (01) forming an initial polycrystalline silicon thin film (04), the initial polycrystalline silicon thin film (04) located at the preset region being a target low temperature polycrystalline silicon thin film (05). The polycrystalline silicon thin film has more uniform crystal size.
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9.发明公开公开(公告)号：US20240234381A9
公开(公告)日：2024-07-11
申请号：US17769825
申请日：2021-06-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xinhong Lu , Xiaoyan Zhu , Chao Liu , Shuilang Dong , Jiushi Wang , Liuqing Li
IPC: H01L25/075 , H01L25/16 , H01L33/62
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/62 , H01L2933/0066
Abstract: A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.
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公开(公告)号：US11699707B2
公开(公告)日：2023-07-11
申请号：US16400607
申请日：2019-05-01
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao Liu , Yujun Zhang , Jing Yu , Julong Feng
IPC: H01L27/12 , G02F1/1362 , H10K59/131
CPC classification number: H01L27/124 , G02F1/136286 , H01L27/1262 , H10K59/131
Abstract: An array substrate, a display panel and a manufacturing method thereof are provided. The array substrate includes a base substrate including a peripheral region; and a lead region located in the peripheral region, the lead region including a plurality of leads, wherein a main plane of the base substrate provided with the plurality of leads includes a first side edge, and the plurality of leads extend to the first side edge, a lateral surface of the base substrate at the first side edge is provided with a concave portion, and an electrode electrically connected with the plurality of leads is disposed in the concave portion.
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