Invention Grant
- Patent Title: Cable connection structure manufacturing method
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Application No.: US17308151Application Date: 2021-05-05
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Publication No.: US12046860B2Publication Date: 2024-07-23
- Inventor: Mikio Nakamura , Hiroaki Shibuya , Takanori Sekido
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: WO TJP2018043577 2018.11.27
- Main IPC: H01R43/02
- IPC: H01R43/02 ; B23K20/10 ; H01R4/02 ; H01R12/53 ; H01R12/57

Abstract:
A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.
Public/Granted literature
- US20210273394A1 CABLE CONNECTION STRUCTURE MANUFACTURING METHOD AND CABLE CONNECTION STRUCTURE Public/Granted day:2021-09-02
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