- 专利标题: Cable connection structure manufacturing method
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申请号: US17308151申请日: 2021-05-05
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公开(公告)号: US12046860B2公开(公告)日: 2024-07-23
- 发明人: Mikio Nakamura , Hiroaki Shibuya , Takanori Sekido
- 申请人: OLYMPUS CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: OLYMPUS CORPORATION
- 当前专利权人: OLYMPUS CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 优先权: WO TJP2018043577 2018.11.27
- 主分类号: H01R43/02
- IPC分类号: H01R43/02 ; B23K20/10 ; H01R4/02 ; H01R12/53 ; H01R12/57
摘要:
A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.
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