Invention Grant
- Patent Title: Two-component solvent-less adhesive composition
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Application No.: US17436434Application Date: 2020-03-04
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Publication No.: US12054652B2Publication Date: 2024-08-06
- Inventor: Tuoqi Li , Joseph J. Zupancic , Matthew M. Yonkey , Paul G. Clark , Thorsten Schmidt , Ken Kawamoto , Wenwen Li
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland; US PA Collegeville
- Agency: Boyle Fredrickson, S.C.
- International Application: PCT/US2020/020921 2020.03.04
- International Announcement: WO2020/180948A 2020.09.10
- Date entered country: 2021-09-03
- Main IPC: C08G18/46
- IPC: C08G18/46 ; B32B7/12 ; B32B15/085 ; B32B27/08 ; B32B27/32 ; B32B27/36 ; C08G18/12 ; C08G18/38 ; C09J175/06 ; C09J175/12
Abstract:
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.
Public/Granted literature
- US20220169901A1 Two-Component Solvent-Less Adhesive Composition Public/Granted day:2022-06-02
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