- 专利标题: Surface-treated copper foil and copper clad laminate
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申请号: US17543645申请日: 2021-12-06
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公开(公告)号: US12060647B2公开(公告)日: 2024-08-13
- 发明人: Chien-Ming Lai , Yao-Sheng Lai , Jui-Chang Chou
- 申请人: CHANG CHUN PETROCHEMICAL CO., LTD.
- 申请人地址: TW Taipei
- 专利权人: CHANG CHUN PETROCHEMICAL CO., LTD.
- 当前专利权人: CHANG CHUN PETROCHEMICAL CO., LTD.
- 当前专利权人地址: TW Taipei
- 代理商 Winston Hsu
- 优先权: CN 2110765546.6 2021.07.06 TW 0124737 2021.07.06
- 主分类号: B32B15/20
- IPC分类号: B32B15/20 ; B32B15/14 ; C25D1/04 ; C25D7/06
摘要:
A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.
公开/授权文献
- US20230019067A1 SURFACE-TREATED COPPER FOIL AND COPPER CLAD LAMINATE 公开/授权日:2023-01-19
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