Invention Grant
- Patent Title: Heat sink
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Application No.: US17918694Application Date: 2021-04-14
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Publication No.: US12063757B2Publication Date: 2024-08-13
- Inventor: Mi Sun Lee , Yong Joo Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & ASSOCIATES, LLP
- Priority: KR 20200045547 2020.04.14
- International Application: PCT/KR2021/004710 2021.04.14
- International Announcement: WO2021/210914A 2021.10.21
- Date entered country: 2022-10-13
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The present invention relates to a heat sink comprising a heat pipe. A heat sink, according to one embodiment of the present invention, comprises: a first heat pipe mounted in a first groove formed on a first surface of a heat sink; a second heat pipe mounted in a second groove formed on a second surface of the heat sink; and a third groove in which at least a portion of the second heat pipe mounted in the second groove is exposed in the direction of the first surface. A method for producing a heat sink comprises the steps of: forming, on a first surface of a heat sink, a first groove in which a first heat pipe is mounted; mounting the first heat pipe on the first surface by disposing and press-fitting the first heat pipe in the first groove; forming, on a second surface of the heat sink, a second groove in which a second heat pipe is mounted; mounting the second heat pipe on the second surface by disposing and press-fitting the second heat pipe in the second groove; and forming a third groove such that at least a portion of the second heat pipe is exposed in the direction of the first surface.
Public/Granted literature
- US20230102931A1 HEAT SINK Public/Granted day:2023-03-30
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