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公开(公告)号:US12069835B2
公开(公告)日:2024-08-20
申请号:US17919321
申请日:2021-04-16
Applicant: LG INNOTEK CO., LTD.
Inventor: Yong Joo Lee , Mi Sun Lee , Ju Young Jang
CPC classification number: H05K7/20336 , H02M3/00 , H05K7/20936
Abstract: A heat sink according to one embodiment of the present invention comprises: a main heat sink; a heat pipe mounted in a groove formed on one surface of the main heat sink; a heat dissipation member which is formed above the heat pipe and transfers heat generated from a heat generation component to the heat pipe; and an elastic member which is mounted in a space formed inside the heat dissipation member and applies pressure to the main heat sink.
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公开(公告)号:US12063757B2
公开(公告)日:2024-08-13
申请号:US17918694
申请日:2021-04-14
Applicant: LG INNOTEK CO., LTD.
Inventor: Mi Sun Lee , Yong Joo Lee
IPC: H05K7/20
CPC classification number: H05K7/20509 , H05K7/20336
Abstract: The present invention relates to a heat sink comprising a heat pipe. A heat sink, according to one embodiment of the present invention, comprises: a first heat pipe mounted in a first groove formed on a first surface of a heat sink; a second heat pipe mounted in a second groove formed on a second surface of the heat sink; and a third groove in which at least a portion of the second heat pipe mounted in the second groove is exposed in the direction of the first surface. A method for producing a heat sink comprises the steps of: forming, on a first surface of a heat sink, a first groove in which a first heat pipe is mounted; mounting the first heat pipe on the first surface by disposing and press-fitting the first heat pipe in the first groove; forming, on a second surface of the heat sink, a second groove in which a second heat pipe is mounted; mounting the second heat pipe on the second surface by disposing and press-fitting the second heat pipe in the second groove; and forming a third groove such that at least a portion of the second heat pipe is exposed in the direction of the first surface.
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