Invention Grant
- Patent Title: Fan module
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Application No.: US18297632Application Date: 2023-04-09
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Publication No.: US12066031B2Publication Date: 2024-08-20
- Inventor: Hsin-Chen Lin , Ing-Jer Chiou
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTEK COMPUTER INC.
- Current Assignee: ASUSTEK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Priority: TW 1136338 2022.09.26
- Main IPC: F04D25/08
- IPC: F04D25/08 ; F04D29/18

Abstract:
A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.
Public/Granted literature
- US20240102483A1 FAN MODULE Public/Granted day:2024-03-28
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