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公开(公告)号:US10718355B2
公开(公告)日:2020-07-21
申请号:US16112975
申请日:2018-08-27
Applicant: ASUSTeK COMPUTER INC.
Inventor: Hsin-Chen Lin , Ing-Jer Chiou
Abstract: A centrifugal fan includes a housing and an impeller. The housing includes a sidewall, and the sidewall includes a tongue portion. The impeller includes a fan hub and a plurality of blades. The fan hub is rotatably disposed in the housing, and the tongue portion has an inner contour line on a reference plane. The blades connect to the fan hub. Each one of the blades has an end surface facing the sidewall. The end surface has an outer contour line on the section of the blade. Any two adjacent blades have different outer contour lines. The outer contour line of at least one first blade of the plurality of blades is parallel to the inner contour line. The outer contour line of at least one second blade of the plurality of blades is not parallel to the inner contour line.
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公开(公告)号:US10519969B2
公开(公告)日:2019-12-31
申请号:US15841499
申请日:2017-12-14
Applicant: ASUSTeK COMPUTER INC.
Inventor: Hsin-Chen Lin , Ing-Jer Chiou
Abstract: A centrifugal fan is provided. The centrifugal fan comprises a housing and an impeller. The housing includes an upper cover and a lower cover. The impeller is configured in the housing. The impeller includes a hub, a plurality of blades and an air guiding structure. The hub is pivoted on the lower cover and rotates around a rotation axis. The rotation axis extends in the axial direction. The blades are connected to a peripheral surface of the hub and configured between the upper cover and the lower cover. The air guiding structure is connected to the blades. An angle between the air guiding structure and the rotation axis increases along with a distance in the direction away from the hub.
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公开(公告)号:US09568022B2
公开(公告)日:2017-02-14
申请号:US14218955
申请日:2014-03-18
Applicant: ASUSTeK COMPUTER INC.
Inventor: Ing-Jer Chiou
CPC classification number: F04D29/666 , F04D17/16 , F04D25/0613
Abstract: An impeller which is applied to a fan includes a hub, a plurality of first centrifugal blade and a plurality of second centrifugal blades. The hub is disposed in an accommodating space of the fan. The first centrifugal blades and the second centrifugal blades are connected to the hub. The first centrifugal blades have first ends away from the hub. The second centrifugal blades have second ends away from the hub. A distance between the second end and a center of the hub is larger than that between the first end and the hub center, and the first centrifugal blades and the second centrifugal blades are arranged periodically. Thus, an airflow noise in a constant frequency generated by the impeller can be avoided, and noises in inconstant frequency would not accumulate or generate annoying noise peak.
Abstract translation: 应用于风扇的叶轮包括轮毂,多个第一离心叶片和多个第二离心叶片。 轮毂设置在风扇的容纳空间中。 第一离心叶片和第二离心叶片连接到轮毂。 第一离心叶片具有远离轮毂的第一端。 第二离心叶片具有远离轮毂的第二端。 毂的第二端和中心之间的距离大于第一端和轮毂中心之间的距离,并且周期性地布置第一离心叶片和第二离心叶片。 因此,可以避免由叶轮产生的恒定频率的气流噪声,并且不变频率的噪声不会累积或产生烦人的噪声峰值。
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公开(公告)号:US10982685B2
公开(公告)日:2021-04-20
申请号:US16255978
申请日:2019-01-24
Applicant: ASUSTeK COMPUTER INC.
Inventor: Hsin-Chen Lin , Ing-Jer Chiou
Abstract: The disclosure provides a heat dissipation device, including an enclosure, a connective member, and a fan module. The enclosure includes a first cover body and a second cover body that are opposite to each other. The second cover body includes an opening. The connective member is connected to one of the first cover body and the second cover body in the enclosure. The fan module is movably connected to the connective member, and is configured to move between a first position and a second position relative to the enclosure based on the connective member. When moving to the first position, the fan module is located in the enclosure.
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公开(公告)号:US10982684B2
公开(公告)日:2021-04-20
申请号:US16254880
申请日:2019-01-23
Applicant: ASUSTeK COMPUTER INC.
Inventor: Hsin-Chen Lin , Ing-Jer Chiou
Abstract: The disclosure provides a centrifugal fan, including an enclosure, a spacer, and a fan blade rotor. The enclosure includes a top panel, a bottom panel, and a side wall connected between the bottom panel and the top panel. The top panel, the bottom panel, and the side wall together form a first air exhaust vent and a second air exhaust vent. The spacer is disposed in the enclosure, is connected between the bottom panel and the top panel, and spaces a first space in communication with the first air exhaust vent and a second space in communication with the second air exhaust vent in the enclosure. The spacer includes a first opening. The first opening is in communication with the first space and the second space. The fan blade rotor is rotatably disposed in the second space.
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公开(公告)号:US10185377B2
公开(公告)日:2019-01-22
申请号:US14981946
申请日:2015-12-29
Applicant: ASUSTeK COMPUTER INC.
Inventor: Chia-Ching Niu , Ing-Jer Chiou , Cheng-Yu Wang
Abstract: A heat dissipation method applied to an electronic device including an electronic component is provided. The heat dissipation method includes: sensing a temperature of an electronic component by the temperature sensor; determining whether the temperature of the electronic component is larger than a threshold temperature; determining a rotation speed rank corresponding to a basic rotation speed and intermittently accelerating the basic rotation speed in the rotation speed rank while the sensed temperature of the electronic device is larger than a threshold temperature.
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公开(公告)号:US20170363097A1
公开(公告)日:2017-12-21
申请号:US15618166
申请日:2017-06-09
Applicant: ASUSTeK COMPUTER INC.
Inventor: Hsin-Chen Lin , Ing-Jer Chiou
Abstract: A fan module includes a first casing, a driving motor disposed in the first casing, a first rotor connected to the first driving motor, a second casing, a second rotor pivotally configured in the second casing, at least one guiding member and a shift apparatus connected to the first casing and the second casing, the first rotor includes a first rotating shaft and a plurality of first blades, the second rotor includes a second rotating shaft and a plurality of second blades, the guiding member is disposed on the first blade and the second blade. The whole height of the blade is adjusted by adjusting the distance between the two group blades, then the efficiency of the fan is improved effectively to optimize the noise level and the air flow.
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公开(公告)号:US09416793B2
公开(公告)日:2016-08-16
申请号:US13845061
申请日:2013-03-17
Applicant: ASUSTeK COMPUTER INC.
Inventor: Ing-Jer Chiou
CPC classification number: F04D29/4226 , F04D17/16 , F04D25/0613 , F04D29/281 , F04D29/30
Abstract: A centrifugal fan includes a housing and a fan body. The housing includes an upper cover and a lower cover. The fan body is disposed in the housing and includes a hub and at least a blade. The hub is pivotally connected to the lower cover. The blade includes an air intake portion and an air exhaust portion. The air intake portion is connected to the peripheral edge of the hub. The air exhaust portion is connected to the air intake portion and is disposed between the upper cover and the lower cover. The width of the air exhaust portion is gradually reduced along a direction away from the air intake portion.
Abstract translation: 离心风扇包括壳体和风扇体。 壳体包括上盖和下盖。 风扇主体设置在壳体中,并且包括轮毂和至少一个叶片。 轮毂枢转地连接到下盖。 叶片包括进气部分和排气部分。 进气部分连接到轮毂的周缘。 排气部分连接到进气部分并且设置在上盖和下盖之间。 排气部的宽度沿着远离进气部的方向逐渐减小。
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公开(公告)号:US12066031B2
公开(公告)日:2024-08-20
申请号:US18297632
申请日:2023-04-09
Applicant: ASUSTeK COMPUTER INC.
Inventor: Hsin-Chen Lin , Ing-Jer Chiou
CPC classification number: F04D29/181 , F04D25/08
Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.
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公开(公告)号:US11690198B2
公开(公告)日:2023-06-27
申请号:US17677491
申请日:2022-02-22
Applicant: ASUSTEK COMPUTER INC.
Inventor: Yi-Chi Lai , Ing-Jer Chiou , Sung-Chuan Huang
IPC: H05K7/20
CPC classification number: H05K7/20209
Abstract: An electronic device is provided. The electronic device includes a first body, a second body, and a baffle structure. The first body includes a first edge. The second body includes a second edge. The first edge is pivotally connected to the second edge, and an air outlet is provided on the second edge. An air duct is formed between the first edge and the second edge. The baffle structure is disposed in the air duct and located at a position corresponding to the air outlet. The baffle structure selectively closes the air duct according to a temperature of the air outlet, to avoid a rising temperature inside the electronic device due to hot air backflow.
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